Schneider Electric Tsxdmz64Dtk Tsx Micro I/O Solid State Module ASEA QHFB 210 Electronic Component • Rugged Design: Rugged enclosure

• Rugged Design: Rugged enclosure to shield against environmental influences and mechanical stress

• Dual Power Input: Allows 80–138 VAC at 47–63 Hz and 20–130 VDC input

-250 vdc max

Bv 222-1-01304

Bussmann 170m2690 fuse 10a 1000v

Schneider Electric Tsxdmz64Dtk Tsx Micro I/O Solid State Module ASEA QHFB 210 Electronic Component • Rugged Design: Rugged enclosureSchneider Electric Tsxdmz64Dtk Tsx Micro I O Solid State Module Schneider Electric Tsxdmz64Dtk Tsx Micro 32 Inputs 24Vdc Iec Type 1 I16 To I31 I0 To I15 32 Prot. Outputs 24Vdc 0. 1A Q16 To Q31 Q0 To Q15 32I 24Vdc + 32Q 0. 1A Conn Iec 61131 2 Pv: 06 Rl: 03 Dom: 0734 Made In France Weight: 370 Gm